LPDDR5 and UFS 3.1 Present Flagship Experience Combine By Samsung

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One of the largest distributors of memory technology in the world, Samsung Electronics has begun mass production of their LPDDR5 UFS 3.1-based multichip package (uMCP) smartphone memory solution. These chip is mixture of both LPDDR5 DRAM with the latest UFS 3.1 NAND flash. Which has give improved memory performance for a wide-range of smartphones.

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However, with both DRAM and NAND network built-in, Samsung uMCP is great at giving fast speeds and high storage capacity at very low power. Moreover, these superiority are key for various 5G applications such as advanced photography, graphics-intensive gaming and augmented reality.

Furthermore, LPDDR5 UFS 3.1 chips are capable of DRAM performance levels of 25GB/s, NAND flash performance at 3GB/s. All within a package size that compute only 11.5mm x 13mm. Samsung will offer DRAM capacities ranging from 6 gigabytes (GB) to 12GB and storage options from 128GB to 512GB for these chips.

Last but not least, samsung has already finished compatibility testing of the LPDDR5 uMCP.  And looking for uMCP-equip devices to hit mainstream markets starting this month.

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